The MDC Precision InvisiFlow™Angle Valve is engineered for advanced vacuum deposition applications, where material buildup often affects valve performance. Its Integrated Heating System (IHS) heats the poppet internally, minimizing particle generation and reducing contamination. By relocating the one-million-cycle welded bellows outside of the process flow, the valve isolates it from particulates and corrosive gases, extending service life and reducing downtime. The redesigned enlarged port diameters and optimized cavity transition deliver high conductance flow without increasing the valve’s footprint, ensuring maximum efficiency in critical processes.

Key Features and Specifications

Integrated Heating System (IHS): Cartridge-style heater with optional thermocouple for precise thermal control.
High Conductance Body: Enlarged ports and optimized cavity reduce flow resistance.
Isolated Welded Bellows: Located outside the process flow to minimize buildup and wear.
Durability: Rated for one-million-cycle operation with robust 304 SS (optional 316 SS) construction.
Flexible Configurations: Available with ISO Flange, CF Flange, or Tube options.
Pressure Range: From 1x10⁻⁹ Torr minimum to 14.7 psi (1 bar) maximum.
Temperature Ratings:
Max valve body temperature: 400°F (200°C)
Max actuator temperature: 400°F (200°C)
Max solenoid temperature: 125°F (50°C)
Compressed Air Requirement: 80–100 psi (5.5–7 bar) for reliable actuation.
Fast Operation: Open/close cycle time of 1 second.
Sealing Options: FKM (standard), with OFE Copper or FFKM alternatives for demanding processes.

Industry Applications

The InvisiFlow™ Angle Valve is ideal for semiconductor manufacturing, thin-film deposition, aerospace engineering, energy research, and vacuum coating applications. Its ability to handle high temperatures, aggressive cleaning, and particle-sensitive processes makes it invaluable for industries requiring ultra-clean, high-conductance vacuum environments. By ensuring extended uptime and reduced contamination, this valve supports precision-driven applications where process stability is critical.