Multipin Instrumentation Feedthroughs provide multiple conductor paths or pins for transmitting signal voltages and currents in vacuum environments. Each unit includes a fastening air-side connector, ensuring a secure and efficient electrical interface. Often used in instrumentation control systems, they serve applications such as electron microscopes, e-beam evaporation, surface science analysis, and semiconductor process control in High Vacuum(HV) or Ultra high vacuum (UHV) environments.

MDC’s Type-D Subminiature feedthroughs are hermetically sealed using advanced glass-ceramic bonding, and come in 9, 15, 25, and 50 pin configurations. They feature standard serial cable interfaces on the air side and UHV-compatible connectors and ribbon cable assemblies on the vacuum side. These designs deliver the benefits of circular multipin connectors with higher pin density and smaller footprints.

The Type-C Subminiature is a 9-pin circular geometry feedthrough ideal for compact installations or environments where Type-D configurations are not suitable. Its circular design supports integration into small vacuum flanges, making it a valuable solution for space-constrained instrumentation setups.

MDC offers three vacuum mount styles: Conflat CF Flange, Kwik-Flange™ ISO KF and Weldable

Industry Applications

MDC’s Multipin Instrumentation Feedthroughs are essential components in a variety of high-tech fields. Common uses include electron microscopy, surface science, e-beam deposition systems, semiconductor manufacturing, plasma diagnostics, and accelerator instrumentation. Their compact, robust design makes them ideal for applications requiring high signal integrity and minimal space consumption in high vauum (hv) and ultra high vacuum (uhv) environments.